RT/duroid 5880 2-Layer 62mil ENIG PCB for Millimeter Wave Applications
1.Introduction of RT/duroid 5880
Rogers RT/duroid 5880 high frequency laminates are PTFE composites reinforced with glass microfibers, designed for exacting stripline and microstrip circuit applications. The randomly oriented microfibers result in exceptional dielectric constant uniformity.
The dielectric constant of RT/duroid 5880 laminates is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5880 laminates to Ku-band and above.
RT/duroid 5880 laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.
2.Key Features
Ultra-Low Dielectric Constant: 2.2 ±0.02 at 10 GHz/23°C
Exceptional Low Loss: Dissipation factor of 0.0009 at 10GHz
Temperature Stability: Temperature coefficient of dielectric constant (TCDk) of -125 ppm/°C
Environmental Resistance: Low Moisture Absorption 0.02%
Thermal Performance: CTE X-axis 31 ppm/°C, Y-axis 48 ppm/°C, Z-axis 237 ppm/°C
High Temperature Capability: Td 500°C TGA
Safety Certified: UL 94-V0
Manufacturing: Lead free Process compatible
Material Consistency: Isotropic properties
3.Benefits
Frequency Stability: Uniform electrical properties over wide frequency range
Easy Fabrication: Easily cut, sheared and machined to shape
Chemical Resistance: Resistant to solvents and reagents used in etching or plating edges and holes
Environmental Durability: Ideal for high moisture environments
Proven Reliability: Well-established material with extensive application history
Optimal Performance: Lowest electrical loss for reinforced PTFE material
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RT/duroid 5880 |
| Layer Count | 2 layers |
| Board Dimensions | 90mm × 90mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 1.6mm |
| Finished Cu Weight | 1oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (12-Layer Rigid Structure)
Copper Layer 1 - 35 μm
RT/duroid 5880 - 5.575 mm (62mil)
Copper Layer 2 - 35 μm
6.PCB Statistics:
Components: 16
Total Pads: 53
Thru Hole Pads: 37
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 49
Nets: 2
7.Typical Applications
Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Applications
Radar Systems
Guidance Systems
Point to Point Digital Radio Antennas
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
